Change log:
- Add separate latch-up circuits for RF and STM parts
- Rework resetdog circuit
- Reposition DC-DC circuit
- Add new lines to the UCI bus: SWDIO, SWDCLK, SWO, NOT_RST and change UCI_COBC_3V3 to UCI_COBC_5V
- Add MCU supervisory circuit (3V cutoff)
- Add a temperature sensor near RF amplifier chip
- Add 3D models
- Increase minimum hole size from 0.2 to 0.3 mm
STM Pinout changes:
- Flash_CS moved from PB9 to PA4
- Dosi_En added on PB10
- WDT_Clear moved from PA9 to PB9
- RF_TMP added on PC0
- RF_LATCHUP_DIS added on PA0